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Stellenbeschreibung

What you will do

• Develop new wafer process modules for SiC wafers (doping, Laser anneal, CVD, etching, cleaning, characterization)
• Execute major process development or integration tasks and build up product and process knowledge
• Leader of small or medium size process integration or optimization projects
• Sub-project leader of process development or integration tasks in complex projects
• Build up and maintain knowledge (technical & procedures) and BG internal & external contacts in own field of expertise
• Active member in PC&O Process improvement teams
• Provide technical mentorship to less experienced engineers

What you will need

• Master’s degree in Semiconductor Device Physics or Semiconductor Technology and/or Microelectronics
• Minimum 3 years’ relevant working experience
• Knowledge of semiconductor devices and industrial semiconductor technology
• Hands on experience in wafer fab process module developments on furnace equipment
• Team player with a strong drive to achieve success
• Fluency in German. Good level in English
• Willingness to travel internationally (approximately 50% during the first 2 years of service)
• Good communication skills, both verbal and in writing