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About the role

Fueled by our goal to become one of the top players in the Power Discretes field with a large growth potential driven by the rapidly expanding markets, we are currently building up a highly talented and ambitious SiC R&D team to grow into the next level. As the (Sr.) Process Integration Engineer for SiC Backside Treatment Processes, you will play an essential part in our strive to become a powerhouse in the electronics field.

What you will do

• Develop new wafer process modules on backside treatment tools for SiC wafers (lamination, delamination, grinding, cleaning)
• Execute major process development or integration tasks and build up product and process knowledge
• Leader of small or medium size process integration or optimization projects
• Sub-project leader of process development or integration tasks in complex projects
• Build up and maintain knowledge (technical & procedures) and Business Group internal & external contacts in own field of expertise
• Active member in PC&O Process improvement teams
• Provide technical mentorship to less experienced engineers

What you will need

• Education in Semiconductor Device Physics or Semiconductor Technology and/or Microelectronics, preferably PhD
• Minimum 3 years relevant work experience, depending on educational credentials
• Knowledge of semiconductor devices and industrial semiconductor technology
• Hands on experience in wafer fab process module developments on backside treatment equipment
• Team player with a strong drive to achieve success
• Fluency in German. Good level in English
• Good communication skills, both verbal and in writing